Three-dimensional FEM simulations of thermomechanical stresses in 1.55 μm laser modules

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn 2002-January, Issue , 2002, Pages 51-56

  Deshayes, Y ^a   Bechoul, L ^a   Danto, Y ^a   Laffitte, D ^b   Goudard, J L ^b  

^a UNIVERSITÉ BORDEAUX 1   (France)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

Building materials; Capacitive sensors; Computational modeling; Conducting materials; Finite element methods; Modular construction; Optical design; Power lasers; Thermal stresses; Thermomechanical processes

Indexed keywords

BUILDING MATERIALS; CAPACITIVE SENSORS; DISSIMILAR MATERIALS; ELASTICITY; FAILURE ANALYSIS; INTEGRATED CIRCUITS; MODULAR CONSTRUCTION; OPTICAL DESIGN; OUTAGES; STRUCTURAL DESIGN; THERMAL STRESS; WELDS;

COMPUTATIONAL MODEL; CONDUCTING MATERIALS; MULTI-PHYSICS COMPUTATION; POWER LASERS; TELECOMMUNICATION APPLICATIONS; THERMO-MECHANICAL ANALYSIS; THERMOMECHANICAL PROCESS; THERMOMECHANICAL SIMULATION;

FINITE ELEMENT METHOD;

EID: 57349109634     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPFA.2002.1025611     Document Type: Conference Paper

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