Advanced resist process enabling implementation of CD controllability for 32nm and beyond

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6923, Issue , 2008, Pages

  Shimura, Satoru ^a   Iwao, Fumiko ^a   Kawasaki, Tetsu ^a   Shannon, Dunn ^b   Tanaka, Yoshitsugu ^a   Yaegashi, Hidetami ^a   Yamada, Yoshiaki ^a  

^a TOKYO ELECTRON LTD   (Japan)

^b TEL TECHNOLOGY CENTER   (United States)

Author keywords

193nm immersion lithography; 32nm node; Double patterning; Litho litho etch (LLE)

Indexed keywords

PHOTOLITHOGRAPHY; PHOTORESISTS; PROCESS ENGINEERING; ULTRAVIOLET DEVICES;

193NM IMMERSION LITHOGRAPHIES; 193NM IMMERSION LITHOGRAPHY; 32NM NODE; ALTERNATIVE TECHNOLOGIES; CD CONTROLLABILITIES; DOUBLE PATTERNING; EXTREME ULTRAVIOLETS; LITHO-LITHO-ETCH (LLE); OPTICAL CONTRASTS; PRESENT STAGES; PROCESS FLOWS; PROCESS TECHNIQUES; PRODUCTION PROCESSES; RESIST PATTERNS; RESIST PROCESSES; SEMICONDUCTOR DESIGNS;

TECHNOLOGY;

EID: 57349092483     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.771867     Document Type: Conference Paper

References (0)