Thermal management for boron nitride filled metal core printed circuit board

Journal of Composite Materials

Volumn 42, Issue 24, 2008, Pages 2615-2627

  Yung, K C ^a   Wang, J ^a   Yue, T M ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Boron nitride; Printed circuit board.; Thermal management

Indexed keywords

BORON; BORON NITRIDE; CARBON FIBER REINFORCED PLASTICS; CONDUCTING POLYMERS; COUPLING AGENTS; ELECTROMAGNETIC WAVE EMISSION; ELECTRONIC EQUIPMENT MANUFACTURE; FILLERS; NITRIDES; POLYCHLORINATED BIPHENYLS; POLYMER MATRIX COMPOSITES; POLYMERS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SURFACE TREATMENT; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMAL SPRAYING; THERMAL VARIABLES CONTROL; THERMOANALYSIS; THERMODYNAMIC PROPERTIES;

BRUGGEMAN MODELS; CONDUCTIVE POLYMER COMPOSITES; CRITICAL PROPERTIES; DIFFERENT SIZES; ELECTRONIC DEVICES; HEAT DISSIPATION CAPABILITIES; LOW COEFFICIENT OF THERMAL EXPANSIONS; METAL CORES; NANO SIZES; THERMAL MANAGEMENT; THERMAL MANAGEMENTS;

THERMAL EXPANSION;

EID: 57049166078     PISSN: 00219983     EISSN: 1530793X     Source Type: Journal    
DOI: 10.1177/0021998308096326     Document Type: Article

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