Effect of thermal stresses on chip-free diode laser cutting of glass

Optics and Laser Technology

Volumn 41, Issue 3, 2009, Pages 318-327

  Nisar, Salman ^a   Sheikh, M A ^a   Li, Lin ^a   Safdar, Shakeel ^b  

^a UNIVERSITY OF MANCHESTER   (United Kingdom)

^b School of Avionics and Electrical Engineering   (Pakistan)

Author keywords

Controlled fracture technique (CFT); Cut deviation; Finite element method

Indexed keywords

BRITTLE FRACTURE; DIODES; FINITE ELEMENT METHOD; FRACTURE; LASER APPLICATIONS; LASER BEAM CUTTING; LASER BEAMS; LASERS; PHOTOGRAPHY; STRENGTH OF MATERIALS; STRESS CONCENTRATION; STRESSES; THERMAL STRESS; THERMOELASTICITY; WINDSHIELDS;

BRITTLE MATERIALS; CONTROLLED FRACTURE TECHNIQUE (CFT); CONTROLLED FRACTURES; CUT DEVIATION; CUT PATHS; DIODE LASERS; FINITE ELEMENT SIMULATIONS; GLASS SHEETS; LASER CLEAVING; LASER CUTTINGS; ON CHIPS; OPTICAL MICROSCOPES; STRESS DISTRIBUTIONS; STRESS FIELDS; SURFACE QUALITIES; TRAILING EDGES;

GLASS;

EID: 57049141632     PISSN: 00303992     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.optlastec.2008.05.025     Document Type: Article

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