Thermal and electronic properties of Bi1 - xSbx alloys

Journal of Alloys and Compounds

Volumn 467, Issue 1-2, 2009, Pages 305-309

  Dutta, Soma ^a   Shubha, V ^a   Ramesh, T G ^a   D'Sa, Florita ^a  

^a SURFACE ENGINEERING DIVISION   (India)

Author keywords

Electronic transport; High pressure; Mechanical alloying; Semiconductors; Thermal analysis

Indexed keywords

ALLOYING; BALL MILLING; CHEMICAL ANALYSIS; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; ELECTRONIC PROPERTIES; MECHANICAL ALLOYING; METALLIC COMPOUNDS; METALLURGY; MICROSCOPIC EXAMINATION; MILLING (MACHINING); SEMICONDUCTOR MATERIALS; THERMAL CONDUCTIVITY; THERMOANALYSIS; THERMOELECTRIC POWER; THERMOELECTRICITY;

BALL DIAMETERS; ELECTRICAL RESISTIVITIES; ELECTRONIC TRANSPORT; HIGH PRESSURE; HOMOGENIZED MATERIALS; INTERBAND SCATTERINGS; MECHANICAL STRENGTHS; MILLING CONDITIONS; MILLING TIMES; POLYCRYSTAL LINES; POWDER SAMPLES; SEMICONDUCTING ALLOYS; SEMICONDUCTOR BEHAVIOURS; SEMICONDUCTORS; TEMPERATURE RANGES; THERMAL ANALYSIS; THERMOELECTRIC MATERIALS; X-RAY DIFFRACTIONS;

CERIUM ALLOYS;

EID: 56949106116     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.11.146     Document Type: Article

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