Adsorption vehavior of coumarin onto a concaved substrate in water under an electric field

Journal of the Electrochemical Society

Volumn 156, Issue 1, 2009, Pages

  Yoshida, Ken Ichi ^a,b   Masuda, Yasuyuki ^a   Sakai, Yasuhiro ^c   Shimomura, Takeshi ^a  

^a TOKYO UNIVERSITY OF AGRICULTURE AND TECHNOLOGY   (Japan)

^b TDK CORPORATION   (Japan)

^c UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; ATOMIC FORCE MICROSCOPY; ELECTRIC FIELD EFFECTS; ELECTRIC FIELD MEASUREMENT; ELECTRIC FIELDS; MICROSCOPIC EXAMINATION; SUBSTRATES;

ADSORPTION BEHAVIORS; AFM IMAGES; ATOMIC FORCES; CONVECTIVE DIFFUSIONS; IN-SITU; NICKEL ELECTRODEPOSITIONS; PREFERENTIAL ADSORPTIONS;

DEWATERING;

EID: 56749157607     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2999350     Document Type: Article

References (11)

1. O. Kardos and D. G. Foulke, Advances in Electrochemistry and Electrochemical Engineering, Vol. 2, P. Delahay, and, C. W. Tobias, Editors, John Wiley & Sons, New York (1962).
2. F. A. Lowenheim, Modern Electroplating, 3rd ed., John Wiley & Sons, New York (1974).
3. D. G. Flouke and O. Kardos, Tech. Proc. Am. Electroplat. Soc., 43, 172 (1956).
4. O. Kardos, Tech. Proc. Am. Electroplat. Soc., 43, 181 (1956).
5. S. S. Kruglikov, N. T. Kudriavtsev, G. F. Vorobiova, and A. Ya. Antonov, Electrochim. Acta, 10, 253 (1965).
6. D. Roha and U. Landau, J. Electrochem. Soc., 137, 824 (1990).
7. J. O. Dukovic and C. W. Tobias, J. Electrochem. Soc., 137, 3748 (1990).
8. K. G. Jordan and C. W. Tobias, J. Electrochem. Soc., 138, 1251 (1991).
9. C. Madore, M. Matlosz, and D. Landolt, J. Electrochem. Soc., 143, 3927 (1996).
10. C. Madore and D. Landolt, J. Electrochem. Soc., 143, 3936 (1996).
11. H. de O. Dias Filho, C. M. C. de Castilho, J. G. V. Miranda, and R. F. S. Andrade, Physica A, 342, 388 (2004).