Multi-level electro-thermal modeling for circuit simulation of packaged power devices

11th IEEE Workshop on Control and Modeling for Power Electronics, COMPEL 2008

Volumn , Issue , 2008, Pages

  Castellazzi, A ^a   Ciappa, M ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT SIMULATION; COUPLED CIRCUITS; POWDERS; POWER ELECTRONICS; SIMULATORS; TECHNICAL PRESENTATIONS; THERMOANALYSIS; THERMOELECTRICITY;

CIRCUIT SIMULATORS; COMPACT MODELS; D COMPACTS; DISTINCTIVE FEATURES; DRIVE SIGNALS; INTEGRATION LEVELS; LEVEL OF DETAILS; MODELING APPROACHES; POWER COMPONENTS; POWER DEVICES; SEMICONDUCTOR PHYSICS;

THREE DIMENSIONAL;

EID: 56649102482     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/COMPEL.2008.4634675     Document Type: Conference Paper

References (17)

1. A. Hefner, D. Blackburn, "Thermal Component Model for Electrothermal Network Simulation", IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 17, No. 3, 1994.
2. M. Ciappa, W. Fichtner, T. Kojima, Y. Yamada, Y. Nishibe, "Extraction of accurate thermal compact models for fast electrothermal simulation of IGBT modules in Hybrid Electric Vehicles", Microelectronics Reliability 45 (2005), 1694-1700.
3. Y. C. Gerstenmayer, A. Castellazzi, G. Wachutka, "Electro-Thermal Simulation of Multi-Chip Modules With Novel Transient Thermal model and Time-Dependent Boundary Conditions", IEEE Transactions on Power Electronics, Vol. 21, No. 1, January 2006.
4. th IEEE Annual Power Electronics Specialists Conference (PESC 2008), Rhodes, Greece, 15-19 June 2008.
5. S. M. Sze, Physics of Semiconductor Devices, J. Wiley & Sons, New York, 1981.
6. B. J. Baliga, Power Semiconductor Devices, PWS Publishing Company, Boston, MA, 1996.
7. th IEEE Annual Power Electronics Specialists Conference (PESC 2008), Rhodes, Greece, 15-19 June 2008.
8. A. Castellazzi, M. Ciappa, J. Urresti-Ibañez, M. Mermet-Guyennet, W. Fichtner, Integrated Compact Modelling of a Planar-Gate Non-Punch-Through 3.3kV-1200A IGBT Module for Insightful Analysis and Realistic Interpretation of the Failure Mechanisms, in Proc. of the 19th IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD 2007), Jeju, South Korea, May 2007.
9. J.W. Slotboom, "The pn-Product in silicon", Solid State Electronics 1977, Vol. 20, pp. 279-283.
10. H.S. Carslaw, J.C. Jäger, Conduction of heat in solids, 2nd Edition, Oxford University Press, USA, 1986.
11. D.V. Griffiths, I.M. Smith, Numerical methods for engineers, CRC Press, Inc., USA, 1991.
12. J.T. Hsu, L. Vu-Quoc, "A rational formulation of thermal circuit models for electro-thermal Simulation - Part I: Finite Element Method", IEEE Transactions on Circuits and Systems, Vol. 43, No. 9, September 1996.
13. S. Garcia Sabiro, "Mixed-Mode System design: VHDL-AMS", Microelectronic Engineering 54 (2000) 171-180.
14. th Conference on Integrated Power Electronics Systems (CIPS2008), Nürnberg, Germany, March 11-13, 2008.
15. L. Vignaux, J. Saiz, A. Castellazzi, P. Ladoux, VHDL-AMS traction drive model including a 3D description of thermal effects, in Proc. of the 19th International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM 2008), Ischia, Italy, June 11-13, 2008.
16. http://www.ansoft.com
17. http://www.ansys.com