High-resolution electron microscopy characterization of nanocrystalline grain boundaries in gold-copper alloys

Thin Solid Films

Volumn 517, Issue 3, 2008, Pages 1182-1185

  Nyakiti, L O ^a   Chaudhuri, J ^a   Jankowski, A F ^a  

^a Texas Tech University   (United States)

Author keywords

Grain boundaries; High resolution electron microscopy; Nanocrystalline

Indexed keywords

ALLOYS; CERIUM ALLOYS; COPPER; COPPER ALLOYS; CRYSTAL GROWTH; DIFFRACTION; ELECTRON MICROSCOPES; FOURIER TRANSFORMS; FREE VOLUME; GRAIN (AGRICULTURAL PRODUCT); GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HOLOGRAPHIC INTERFEROMETRY; METALLIC COMPOUNDS; MICROSCOPIC EXAMINATION; NANOCRYSTALLINE ALLOYS; NANOCRYSTALLINE MATERIALS; NANOSTRUCTURED MATERIALS;

ATOMIC ARRANGEMENTS; CRYSTALLINE NATURES; EXTENDED DEFECTS; FUNDAMENTAL CHANGES; GRAIN BOUNDARY STRUCTURES; HIGH RESOLUTIONS; LATTICE IMAGING; LOCALIZED DEFORMATIONS; NANOCRYSTALLINE; NANOCRYSTALLINE GRAINS; PROCESSING TECHNIQUES; SELECTED AREA DIFFRACTION PATTERNS; STRENGTH BEHAVIORS;

HIGH RESOLUTION ELECTRON MICROSCOPY;

EID: 56649088239     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.06.007     Document Type: Article

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