A 3D computational model of heat transfer coupled to phase change in multilayer materials with random thermal contact resistance

International Journal of Thermal Sciences

Volumn 48, Issue 2, 2009, Pages 421-427

  Amara, M ^a,b   Timchenko, V ^a   El Ganaoui, M ^b   Leonardi, E ^a   de Vahl Davis, G ^a  

^a UNIVERSITY OF NEW SOUTH WALES   (Australia)

^b UNIVERSITY OF LIMOGES   (France)

Author keywords

CFD; Plasma spraying; Soldification; Thermal contact resistance

Indexed keywords

CONTACT RESISTANCE; COOLING; HEAT EXCHANGERS; HEAT RESISTANCE; HEAT TRANSFER; HEATING EQUIPMENT; INDUSTRIAL APPLICATIONS; PHASE INTERFACES; PLASMA SPRAYING; PROTECTIVE COATINGS; RANDOM PROCESSES; RAPID SOLIDIFICATION; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL SPRAYING; THERMOANALYSIS; THREE DIMENSIONAL;

CFD; COLD SUBSTRATES; COMMERCIAL PACKAGES; COMPUTATIONAL MODELS; COMPUTATIONAL RESULTS; CONTACT POINTS; COOLING RATES; DISTRIBUTION MODELS; IN HOMOGENEITIES; METAL DROPLETS; MULTILAYER MATERIALS; NEW MODELS; PHASE CHANGE PHENOMENONS; PHASE CHANGES; RANDOM DISTRIBUTIONS; RANDOM MODELS; RAPID COOLING; SOLDIFICATION; TEMPERATURE HISTORIES; THERMAL CONTACT RESISTANCE; THERMAL CONTACT RESISTANCES; TWO LAYERS; UNIFORM DISTRIBUTIONS;

PHASE CHANGE MATERIALS;

EID: 56649083748     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2008.03.008     Document Type: Article

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