Study on the thermoforming of PC films used for in-mold decoration

International Communications in Heat and Mass Transfer

Volumn 35, Issue 8, 2008, Pages 967-973

  Chen, Shia Chung ^a   Huang, Shih Tsun ^a   Lin, Ming Chung ^a,b   Chien, Rean Der ^a,b  

^a CHUNG YUAN CHRISTIAN UNIVERSITY   (Taiwan)

^b NANYA INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

In mold decoration; Stretching ratio; Thermoforming; Warpage

Indexed keywords

FILM PREPARATION; FILM THICKNESS; MOLDING; THERMOFORMING; THICKNESS CONTROL;

DIMENSIONAL VARIATIONS; IN-MOLD DECORATIONS; PREHEATING TEMPERATURE; PROCESSING PARAMETERS; STRETCHING RATIOS; THICKNESS DISTRIBUTIONS; WALL THICKNESS DISTRIBUTION; WARPAGES;

MOLDS;

EID: 56349165556     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.icheatmasstransfer.2008.04.008     Document Type: Article

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