A kinetic study on the electrodeposition of Ni-Cr alloy on copper for embedded resister layer in PCB

Advanced Materials Research

Volumn 47-50 PART 1, Issue , 2008, Pages 754-757

  Son, Seong Ho ^a   Chung, Do Won ^a   Kwon, Dae Chol ^a   Lee, Hong Kee ^a  

^a Korea Institute of Industrial Technology   (South Korea)

Author keywords

Activation energy; Electrical resistance; Electrodeposition; Embedded resister layer; Nickel chromium alloy

Indexed keywords

ACTIVATION ENERGY; BINARY ALLOYS; COPPER; DEPOSITS; ELECTRIC RESISTANCE; ELECTRODEPOSITION; ELECTRODES; FUNCTIONAL MATERIALS; KINETIC THEORY; NICKEL ALLOYS; PRINTED CIRCUIT BOARDS; ROTATING DISKS; THIN FILM CIRCUITS; ALLOYS; CHROMIUM; NICKEL; SURFACE RESISTANCE;

ELECTRICAL RESISTANCES; ELECTROCHEMICAL REACTIONS; ELECTRODEPOSITION METHODS; EMBEDDED PASSIVES; EMBEDDED RESISTER LAYER; NICKEL-CHROMIUM ALLOYS; TEMPERATURE RANGE; THIN FILM RESISTORS;

CHROMIUM ALLOYS;

EID: 56349095839     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/amr.47-50.754     Document Type: Conference Paper

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