Unusual thermal fatigue behaviors in 60 nm thick Cu interconnects

Scripta Materialia

Volumn 60, Issue 4, 2009, Pages 228-231

  Zhang, J ^a   Zhang, J Y ^a   Liu, G ^a   Zhao, Y ^a   Ding, X D ^a   Zhang, G P ^b   Sun, J ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Thermal fatigue; Thin films

Indexed keywords

COPPER; OPTICAL INTERCONNECTS; THERMAL FATIGUE; THICK FILMS;

ALTERNATING CURRENTS; CU INTERCONNECTS; CYCLING TEMPERATURES; FATIGUE BEHAVIORS; FATIGUE CURVES; FATIGUE MECHANISMS; HIGH THERMALS; SINGLE LAYERS;

FATIGUE DAMAGE;

EID: 56249113298     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2008.10.012     Document Type: Article

References (19)

1. Huang M., Suo Z., and Ma Q. Acta Mater. 49 (2001) 3039
2. Philofsky E., Ravi K., Hall K., and Black J. Proceedings of the Nineth Annual Proceeding of Reliability Physics (1971), IEEE 120
3. Keller R.R., Mönig R., Volkert C.A., Arzt E., Schwaiger R., and Kraft O. Proceedings of the Sixth International Workshop on Stress-Induced Phenomena in Metallization (2002), American Institute of Physics, New York p. 119
4. Mönig R., Park Y.B., and Volkert C.A. Proceedings of the Eighth International Workshop on Stress-Induced Phenomena in Metallization (2006), American Institute of Physics, New York p. 147
5. Mönig R., Keller R.R., and Volkert C.A.. Rev. Sci. Instrum. 75 (2004) 4997
6. Zhang G.P., Volkert C.A., Schwaiger R., Wellner P., Arzt E., and Kraft O. Acta Mater. 54 (2006) 3127
7. Zhang G.P., Volkert C.A., Schwaiger R., Wellner P., Arzt E., and Kraft O. J. Mater. Res. 201 (2005) 20
8. Kraft O., Wellner P., Hommel M., Schwaiger R., and Arzt E. Z. Metallkd. 93 (2002) 392
9. Park Y.B., Mönig R., and Volkert C.A. Thin Solid Films 515 (2007) 3253
10. Park Y.B., Mönig R., and Volkert C.A. Thin Solid Films 504 (2006) 321
11. Kraft O., and Arzt E. Acta Mater. 46 (1998) 3733
12. Hauschildt M., Gall M., Thrasher S., Justison P., Michaelson L., Hernandez R., Kawasaki H., and Ho P.S. Appl. Phys. Lett. 88 (2006) 211907
13. He J., Suo Z., Marieb T.N., and Maiz J.A. Appl. Phys. Lett. 85 (2004) 4639
14. An J.H., and Ferreira P.J. Appl. Phys. Lett. 89 (2006) 151919
15. Ang D., Wong C.C., and Ramanujan R.V. Thin Solid Films 515 (2007) 3246
16. Okabayashi H. Mater. Sci. Eng. R 11 (1993) 191
17. Wang D., Volkert C.A., and Kraft O. Mater. Sci. Eng. A (2007) 10.1016/j.msea. 2007.06.092
18. Kraft O., Schwaiger R., and Wellner P. Mater. Sci. Eng. A 919 (2001) 319
19. Huang H.L., and Ho N.J. Mater. Sci. Eng. A 293 (2000) 7