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Volumn 8, Issue 7, 2008, Pages 3416-3421

Formation of copper nanowires by electroless deposition using microtubules as templates

Author keywords

Characterization; Copper nanowires; Electrolee deposition

Indexed keywords

ASCORBIC ACIDS; AVERAGE DIAMETERS; COPPER METALLIZATION; COPPER NANOWIRES; COPPER SULFATES; ELECTROLEE DEPOSITION; ELECTROLESS DEPOSITIONS; INNER CORES; INNER DIAMETERS; INTER-CONNECTS; METALLIZATION; MICROSCOPIC CHARACTERIZATIONS; MICROTUBULES; PLATING BATHS; TUBULAR STRUCTURES; UNIFORM NANOWIRES;

EID: 55949089135     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2008.122     Document Type: Article
Times cited : (26)

References (21)
  • 8
    • 55949100009 scopus 로고    scopus 로고
    • US Patent Application, Pub
    • No: US200410063915A1, April 1
    • B. A. Diners, M. A. Harmer, and G. Mitchell, US Patent Application, Pub. No: US200410063915A1, April 1 (2004).
    • (2004)
    • Diners, B.A.1    Harmer, M.A.2    Mitchell, G.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.