Moisture-cured polyurethane/polysiloxane copolymers: Effects of the structure of polyester diol and NCO/OH ratio

Journal of Applied Polymer Science

Volumn 108, Issue 6, 2008, Pages 3644-3651

  Jiang, Hongmei ^a   Zheng, Zhen ^a   Song, Wenhui ^a   Wang, Xinling ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Moisture curing; Morphology; Polysiloxane; Polyurethane; Solvent polymerization

Indexed keywords

ABS RESINS; AMINES; CHEMICAL REACTIONS; COPOLYMERIZATION; COPOLYMERS; CURING; HOT MELT ADHESIVES; MOISTURE; MONOMERS; ORGANIC COMPOUNDS; PLASTIC PRODUCTS; POLYMER MELTS; POLYMERIZATION; SILANES; SILICONES;

BUILDING BLOCKS; CAPPING AGENTS; DIELECTRIC BEHAVIORS; DIOL STRUCTURES; MOLECULAR ARCHITECTURES; NCO/OH RATIOS; POLY SILOXANES; POLYSILOXANE; SOFT SEGMENTS; SOLUTION POLYMERIZATIONS; STRUCTURE VARIATIONS; THERMAL STABILITIES;

POLYMERS;

ADHESIVE AGENT; COATING; COPOLYMER; MORPHOLOGY; POLYESTER; POLYSILOXANE; POLYURETHANE; TENSILE PROPERTY; THERMAL STABILITY;

EID: 55849136589     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.27343     Document Type: Article

References (22)

1. Oertel, G., Ed. Polyurethane Handbook 2; Hanser: New York, 1983.
2. Kuo, P. L.; Liang, W. J.; Lin, C. L. Macromol Chem Phys 2002, 203, 230.
3. Li, X. R.; Fei, G. Q.; Wang, H. H. J Appl Polym Sci 2006, 100, 40.
4. Y1lgör, E.; Y1lgör, L Polymer 2001, 42, 7953.
5. Park, H. B.; Kim, C. K.; Lee, Y. M. J Membr Sci 2002, 204, 257.
6. Zhu, Q. Z.; Feng, S. Y.; Zhang, C. J Appl Polym Sci 2003, 90, 310.
7. Berrocal, M. J.; Badr, I. H. A.; Gao, D. Y.; Bachas, G. B. Anal Chem 2001, 73, 5328.
8. Madhavan, K.; Reddy, B. S. J Polym Sci Part A: Polym Chem 2006, 44, 2980.
9. Gunatillake, P. A.; Meijs, G. F.; McCarthy, S. J.; Adhikari, R. J. J Appl Polym Sci 2000, 76, 2026.
10. Adhikari, R. J.; Gunatillake, P. A.; McCarthy, S. J.; Meijs, G. F. J Appl Polym Sci 2000, 78, 1071.
11. Wang, L. F.; Glass, T. E.; Ward, T. C.; McGrath, J. E.; Muggli, M.; Burns, G.; Sorathia, U. Polymer 2000, 41, 5083.
12. Fan, Q. L.; Fang, J. L.; Chen, G. M.; Yu, X. H. J Appl Polym Sci 1999, 74, 2552.
13. Lee, S. Y.; Lee, S. J.; Kim, B. K. Polym Int 1997, 42, 67.
14. Li, X. R.; Fei, G. Q.; Wang, H. H. J Appl Polm Sci 2006, 100, 40.
15. Lee, S. Y.; Lee, S. J.; Kim, B. K. Polym Int 1997, 42, 67.
16. Petrovic, P. S.; Javni, I.; Divjakovic, V. J Polym Sci Part B: Polym Phys 1998, 36, 221.
17. Kozakiewicz, J.; Janik, H.; Kwiatkowski, R.; Wlochowicz, A. Polym Adv Technol 2000, 11, 82.
18. Ma, C.-C. M. Kuan, H.-C.; Hsieh, J.-C.; Chiang, C.-H. J Membr Sci 2003, 38, 3933.
19. Y1lgör, E.; Y1lgör, Ì. Polymer 2001, 42, 7953.
20. Delpech, M. C.; Coutinho, F. M. B. Polym Test 2000, 19, 939.
21. Patai, S.; Rappoport, Z. The Chemistry of Organic Silicon Compounds; New York: Wiley, 1989.
22. Chen, H.; Fan, Q. L.; Chen, D. Z.; Yu, X. H. J Appl Polym Sci 2001, 79, 295.