Effect of local hot spots on the maximum dissipation rates during flow boiling in a microchannel

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 2 SPEC. ISS., 2008, Pages 407-416

  Revellin, Rémi ^a   Quibén, Jesus Moreno ^b   Bonjour, Jocelyn ^a   Thome, John R ^c  

^a UNIVERSITÉ DE LYON   (France)

^b Wolverine Tube Inc   (Portugal)

^c EPFL   (Switzerland)

Author keywords

Critical heat flux (CHF); Flow boiling; Hot spot; Microchannel; Model

Indexed keywords

CHANNEL DIAMETERS; CRITICAL HEAT FLUX (CHF); DISSIPATION RATES; FLOW BOILING; GATE OXIDE SHORTS; HEATED LENGTHS; HOT SPOT; MASS FLUXES; MICRO CHANNEL HEAT SINKS; MICROCHANNEL COOLING; NON-UNIFORM; POWER DISSIPATIONS; PROCESSOR CHIPS; SATURATION TEMPERATURES; THEORETICAL MODELS; UNIFORM HEATING; VERY HIGH HEAT FLUXES;

CABLE STAYED BRIDGES; COOLING; HEAT FLUX; HEAT SINKS; TABLE LOOKUP;

MICROCHANNELS;

EID: 55849134063     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.916841     Document Type: Conference Paper

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