Influence of nanoclay on urea-formaldehyde resins for wood adhesives and its model

Journal of Applied Polymer Science

Volumn 109, Issue 4, 2008, Pages 2442-2451

  Lei, Hong ^a,b   Du, Guanben ^a   Pizzi, Antonio ^b   Celzard, A ^b  

^a SOUTHWEST FORESTRY UNIVERSITY   (China)

^b UNIVERSITÉ DE LORRAINE   (France)

Author keywords

Adhesives; Modeling; Nanocomposites; Networks; Resins

Indexed keywords

ABS RESINS; ACIDS; ADHESIVES; CLAY MINERALS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; FORMALDEHYDE; LASER INTERFEROMETRY; METABOLISM; NANOCOMPOSITES; NANOSTRUCTURED MATERIALS; PARTICLE BOARD; PLYWOOD; RESINS; SILICATE MINERALS; SODIUM; THERMOSETS; UREA; WOOD PRODUCTS; X RAY ANALYSIS;

ACCELERATING EFFECTS; AND MODELS; ATOMIC STRUCTURES; CRYSTALLINE STRUCTURES; ENVIRONMENT CHARACTERISTICS; FORMALDEHYDE RESINS; INTERNAL BONDS; MODELING; NANO PLATELETS; NANOCLAY; NETWORKING CAPABILITIES; NETWORKS; PERCOLATION THEORIES; UF RESINS; WATER RESISTANCES; WOOD ADHESIVES; WOOD PARTICLEBOARDS; X-RAY DIFFRACTIONS;

UREA FORMALDEHYDE RESINS;

ADHESIVES; CALORIMETRY; CLAY; FORMALDEHYDE; INTERFEROMETRY; METABOLISM; PARTICLE BOARDS; PLY WOOD; SYNTHETIC POLYMERS; UREA;

ADHESIVE AGENT; ADHESIVE PROPERTY; CALORIMETRY; CURING (CHEMISTRY); NANOCOMPOSITE; RESIN; THERMOSETTING PROPERTY; WATER RESISTANCE;

EID: 55849125462     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.28359     Document Type: Article

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