Interfacial reaction of electroless Ni-P plating with Sn-3.5Ag (-Co) solder

Materials Science Forum

Volumn 580-582, Issue , 2008, Pages 243-246

  Nishikawa, Hiroshi ^a   Komatsu, Akira ^a   Takemoto, Tadashi ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Co addition; Electroless Ni P plating; Interfacial reaction; Lead free solder; Pull strength

Indexed keywords

BINARY ALLOYS; COBALT; LEAD-FREE SOLDERS; SOLDERING;

COADDITION; COMPOUND FORMATION; ELECTROLESS NI-P; ELECTROLESS NI-P PLATING; INTERMETALLICS COMPOUNDS; JOINT STRENGTH; PULL STRENGTH; SN-3.5AG; SN-AG SOLDER; SOLDER JOINTS;

FLIP CHIP DEVICES;

EID: 55849087300     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.580-582.243     Document Type: Conference Paper

References (5)

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