Micro-channel heat sink with slurry of water with micro-encapsulated phase change material: 3D-numerical study

Applied Thermal Engineering

Volumn 29, Issue 2-3, 2009, Pages 445-454

  Sabbah, Rami ^a   Farid, Mohammad M ^b   Al Hallaj, Said ^a  

^a Illinois Institute of Technology   (United States)

^b UNIVERSITY OF AUCKLAND   (New Zealand)

Author keywords

Heat sink; MEPCM; Micro channel; Micro encapsulated phase change material; Modeling; Slurry

Indexed keywords

BUOYANCY; COOLING WATER; ELECTRIC POWER SYSTEMS; FLUID DYNAMICS; HEAT SINKS; HEAT TRANSFER; HEATING EQUIPMENT; LAMINAR FLOW; MELTING POINT; NUMERICAL ANALYSIS; PHASE CHANGE MATERIALS; THERMOELECTRIC EQUIPMENT;

CHANNEL INLETS; COOLING FLUIDS; ELECTRONIC DEVICES; HEAT DISSIPATIONS; HEAT FLUX RATES; HIGH POWERS; HYDRAULIC PERFORMANCES; MELTING TEMPERATURES; MEPCM; MICRO-CHANNEL; MICRO-ENCAPSULATED PHASE CHANGE MATERIAL; MODELING; NUMERICAL STUDIES; OUTLET TEMPERATURES; PUMPING POWERS; RECTANGULAR CHANNELS; TEMPERATURE DEPENDENT PHYSICAL PROPERTIES; UNIFORM TEMPERATURES; WATER SLURRIES;

THREE DIMENSIONAL;

EID: 55549120882     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2008.03.027     Document Type: Article

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