Flame retardancy and dielectric properties of dicyclopentadiene-based benzoxazine cured with a phosphorus-containing phenolic resin

Journal of Applied Polymer Science

Volumn 110, Issue 4, 2008, Pages 2413-2423

  Hwang, Hann Jang ^a   Lin, Chi Y ^b   Wang, Chun Shan ^b  

^a CHUNG HWA UNIVERSITY OF MEDICAL TECHNOLOGY   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Crosslinking; Curing of polymers; Dielectric properties; Flame retardance; Thermosets

Indexed keywords

ABS RESINS; CERAMIC CAPACITORS; CURING; DIELECTRIC PROPERTIES; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; ELECTRIC PROPERTIES; FLAME RESISTANCE; FLAMMABILITY; GLASS; GLASS TRANSITION; GRAVIMETRIC ANALYSIS; LASER INTERFEROMETRY; MELAMINE FORMALDEHYDE RESINS; MOISTURE; NONMETALS; PHENOLS; PHOSPHORUS; PLASTICS; RESINS; SUPERCONDUCTING TRANSITION TEMPERATURE; SYSTEM STABILITY; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS; THERMOSETS;

BENZOXAZINE; BIPHENOL; BISPHENOL; CURING BEHAVIORS; CURING OF POLYMERS; DICYCLOPENTADIENE; DIELECTRIC ANALYZERS; DIPHENOL; DYNAMIC MECHANICALS; ELECTRICAL PROPERTIES; FLAME RETARDANCE; FLAME RETARDANCY; MOISTURE RESISTANCES; MOLAR RATIOS; NOVOLAC; PHENOL FORMALDEHYDES; PHOSPHORUS CONTENTS; THERMAL STABILITIES; TRANSITION TEMPERATURES;

PHENOLIC RESINS;

CALORIMETRY; COPOLYMER; COPOLYMERIZATION; CURING (CHEMISTRY); ELECTRICAL PROPERTY; FLAME RESISTANCE; RESIN; THERMAL STABILITY; THERMOGRAVIMETRY;

EID: 55349097134     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.28787     Document Type: Article

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