Strategies for energy reduction in semiconductor manufacturing

Solid State Technology

Volumn 51, Issue 10, 2008, Pages 30-35

  Huang, T ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLIMATE CHANGE; CLIMATOLOGY; ELECTRIC CONDUCTIVITY; SEMICONDUCTOR MATERIALS;

CONSERVE ENERGIES; ENERGY REDUCTIONS; PROCESSING EQUIPMENTS; PRODUCTION COSTS.; SEMICONDUCTOR MANUFACTURING;

ENERGY CONSERVATION;

EID: 55149087234     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (7)

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2. R. Cohen, "Field Survey of Wafer Fab Cleanroom Air Management," ISMI Technical Transfer Publication #07W4875A-ENG, Oct. 2007.
3. R. Cohen, "Methods and Efficiency of Adiabatic Humidification for Semiconductor Cleanrooms," ISMI Technical Transfer Publication #08034927A-ENG, May 2008.
4. A. Giles, P. Breder, "Analysis and Energy Usage for Three 300mm Process Tools: RTP, Cu CMP and PECVD," ISMI Technical Transfer Publication #08024923A-ENG, Mar. 2008.
5. S. Hinson, D. Ranum, T. Huang, "Analysis and Energy Usage in Three Process Tools," SEMATECH Technical Transfer Publication #99113843B-ENG, Jan. 2000
6. P. Naughton, J. Weale; "ISMI Vacuum Pump Idle Mode Energy and Characterization Demonstration Projects," ISMI Technical Transfer Publication #06094784A-ENG, Sept. 2006.
7. J. Holsbrink, J. Gompel, S. Pampel; "Idle Mode Energy Savings for Pointof-Use (POU) Abatement Equipment," ISMI Technical Transfer Publication #07124899A-ENG, Dec. 2007.