Interface-adhesion-enhanced bi-layer conformal coating for avionics application

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 302-310

  Wu, Jiali ^a,b   Pike, R T ^a,b   Wong, C P ^a,b  

^a University of New South Wales   (Australia)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BIOPHYSICS; CHEMICAL BONDS; COATINGS; COUPLING AGENTS; ELECTRIC INSULATION; ELECTRONICS PACKAGING; ENGINES; FIGHTER AIRCRAFT; INTERFACES (MATERIALS); ION ENGINES; IONIC CONDUCTION; MOISTURE; SILICONES; STRESS RELIEF; WEAR RESISTANCE;

ADHESION ENHANCEMENT; AVIONICS APPLICATIONS; CHEMICAL COMPATIBILITY; DIELECTRIC INSULATIONS; ENVIRONMENTAL CONDITIONS; INSULATION CHARACTERISTICS; SILANE COUPLING AGENT; TEMPERATURE FLUCTUATION;

PACKAGING MATERIALS;

EID: 55049139052     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757330     Document Type: Conference Paper

References (8)

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4. Parylene technical data web site: http://www.paratronix.com/tdata/
5. E.P. Plueddemann, "Adhesion Through Silane Coupling Agents", Proceeding of the 25th Annual SPI PR/C Conference, Section 13-D, pl-10(1970)
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7. C.P. Wong and R. McBride, "Preencapsulation Cleaning Methods and Control for Microelectronics Packaging", IEEE Transaction on CMPT, Part A, Vol. 17-4, p. 542 (1994)
8. L. You, G. R. Yang, C.I. Lang, P. Wu, and J.A. Moore, "Vapor deposition of parylene films from precursors" Proceedings of the 3rd Biennial Meeting of Chemical Perspectives of Microelectronic Materials, Boston, MA, USA( 1992).