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Volumn , Issue , 2008, Pages 756-761

Roadmap to adopting OPC UA

Author keywords

[No Author keywords available]

Indexed keywords

SPECIFICATIONS;

EID: 54849420305     PISSN: 19354576     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/INDIN.2008.4618203     Document Type: Conference Paper
Times cited : (99)

References (7)
  • 1
    • 54849439212 scopus 로고    scopus 로고
    • Implementing OPC UA in Java; Mikko Salmenperä, Seppo Kuikka, Jyrki Peltoniemi, Tommi Karhela, Marko Mattila, Jouni Aro, Olli Snellman, Esa Salonen; Automaatio 07 Seminar; Finnish Society of Automation; 2007; ISBN 978-952-5183-33-7
    • Implementing OPC UA in Java; Mikko Salmenperä, Seppo Kuikka, Jyrki Peltoniemi, Tommi Karhela, Marko Mattila, Jouni Aro, Olli Snellman, Esa Salonen; Automaatio 07 Seminar; Finnish Society of Automation; 2007; ISBN 978-952-5183-33-7
  • 2
    • 54849423376 scopus 로고    scopus 로고
    • OPC Foundation;'OPC Unified Architecture Specification Part 1: Concepts', Version: Release 1.00; July 20063.OPC Foundation;' OPC Unified Architecture Specification Part 3: Address Space Model', Version: Release 1.00; July 2006
    • OPC Foundation;'OPC Unified Architecture Specification Part 1: Concepts', Version: Release 1.00; July 20063.OPC Foundation;' OPC Unified Architecture Specification Part 3: Address Space Model', Version: Release 1.00; July 2006
  • 3
    • 54849413300 scopus 로고    scopus 로고
    • OPC Foundation;'OPC Unified Architecture Specification Part 5: Information Model', Version: Release 1.00; July 2006
    • OPC Foundation;'OPC Unified Architecture Specification Part 5: Information Model', Version: Release 1.00; July 2006
  • 4
    • 54849435582 scopus 로고    scopus 로고
    • Providing device integration with OPC UA, Hadlich, T., Industrial Informatics, 2006 IEEE International Conference on, Aug. 2006.
    • Providing device integration with OPC UA, Hadlich, T., Industrial Informatics, 2006 IEEE International Conference on, Aug. 2006.
  • 5
    • 54849403235 scopus 로고    scopus 로고
    • Bender K., Grossmann, D., Danzer, B, Future Device Integration, V1. 1, TUM, ITM, 2007.
    • Bender K., Grossmann, D., Danzer, B, Future Device Integration, V1. 1, TUM, ITM, 2007.
  • 6
    • 54849404206 scopus 로고    scopus 로고
    • OPC Unified Architecture
    • OPC Foundation, DevCon
    • OPC Foundation, DevCon 2007, OPC Unified Architecture, Conference Materials
    • (2007) Conference Materials


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.