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Volumn 20, Issue 5, 2008, Pages 322-335

Bond strength and etching pattern of adhesive systems to enamel: Effects of conditioning time and enamel preparation

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EID: 54749145119     PISSN: 14964155     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1708-8240.2008.00202.x     Document Type: Article
Times cited : (14)

References (44)
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