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Volumn , Issue 9, 2008, Pages
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Research on transient liquid phase diffusion bonding process of TiNi shape memory alloy to stainless steel
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Author keywords
Shear strength; Stainless steel; TiNi shape memory alloy; Transient liquid phase diffusion bonding
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Indexed keywords
BINARY ALLOYS;
COPPER ALLOYS;
COPPER METALLOGRAPHY;
DIFFUSION;
DIFFUSION BONDING;
IRON METALLOGRAPHY;
LIQUIDS;
NICKEL METALLOGRAPHY;
SCANNING ELECTRON MICROSCOPY;
SHAPE-MEMORY ALLOY;
SHEAR STRENGTH;
SILVER ALLOYS;
SILVER METALLOGRAPHY;
STAINLESS STEEL;
TITANIUM ALLOYS;
TITANIUM METALLOGRAPHY;
WELDS;
X RAY DIFFRACTION ANALYSIS;
BONDING PRESSURE;
BONDING TEMPERATURES;
ELEMENT DISTRIBUTION;
JOINT PROPERTY;
PROCESS PARAMETERS;
SPECIFIC PRESSURE;
TI-NI SHAPE MEMORY ALLOYS;
TRANSIENT LIQUID-PHASE DIFFUSION BONDING;
NICKEL STEEL;
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EID: 54549127276
PISSN: 10014381
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (9)
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References (9)
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