Single pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO2 laser

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5339, Issue , 2004, Pages 276-283

  Moorhouse, C J ^a   Villarreal, F ^a   Wendland, J J ^a   Baker, H J ^a   Hall, D R ^a   Hand, D P ^a  

^a HERIOT WATT UNIVERSITY   (United Kingdom)

Author keywords

Carbon dioxide lasers; Drilling; Microvia; Resin coated copper

Indexed keywords

COATING TECHNIQUES; COPPER; DRILLING; LIGHT ABSORPTION; OPTICAL PROPERTIES; PLASMA ETCHING; PRINTED CIRCUIT BOARDS; RESINS; THERMODYNAMIC PROPERTIES; WAVEGUIDES;

MICROVIA; PLANAR WAVEGUIDES; RESIN COATED COPPER; THRESHOLD FLUENCE;

CARBON DIOXIDE LASERS;

EID: 5444222668     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.532310     Document Type: Conference Paper

References (4)

1. J.H. Lau and C. Chang, An overview of microvia technology, Circuit World 26, 22-32 (2000).
2. M.Bruckner, J.H. Schaffer and J. Uhlenbusch, Ellipsometric measurement of the optical constants of solid and molten alumium and copper at λ=10.6μm. J. Appl. Phys. 66, 1326-1332 (1989)
3. 2 lasers. Appl. Phys. Lett. 78, 2276-2278.(2001)
4. W.E. Maher and R.B. Hall, Pulsed laser heating profile width and changes in total coupling with pulse length and pressure. J. Appl. Phys. 51,1338-1344 (1980)