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Volumn , Issue , 2008, Pages 73-76

A Combined transfer function and neural network method for modeling via in multilayer circuits

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC COILS; ELECTRONIC EQUIPMENT MANUFACTURE; FUNCTIONS; IMAGE CLASSIFICATION; INTEGRATED CIRCUITS; MULTILAYERS; NETWORK PROTOCOLS; NEURAL NETWORKS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PROBABILITY DENSITY FUNCTION; SENSOR NETWORKS; TRANSFER FUNCTIONS;

EID: 54249157578     PISSN: 15483746     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSCAS.2008.4616739     Document Type: Conference Paper
Times cited : (8)

References (14)
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  • 2
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  • 3
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    • Modeling and analysis of vias in dataseted integrated circuits
    • Feb
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  • 8
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    • P. Burrascano, S. Fiori, and M. Mongiardo, "A review of artifical neural networks applications in microwave computer-aided design", Int. J. RF and Microwave CAE, vol. 9, pp. 158-174, 1999.
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  • 9
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  • 10
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.