Corrigendum to: "Electromechanical behaviour of a finite piezoelectric layer under a flat punch" [International Journal of Solids and Structures 45 (2008) 6384-6398] (DOI:10.1016/j.ijsolstr.2008.08.001);Electromechanical behaviour of a finite piezoelectric layer under a flat punch

International Journal of Solids and Structures

Volumn 45, Issue 25-26, 2008, Pages 6384-6398

  Wang, B B L ^a   Han, J C ^a   Du, S Y ^a   Zhang, H Y ^a   Sun, Y G ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Electromechanical behaviour; Fracture mechanics; Piezoelectric materials; Punch

Indexed keywords

FRACTURE MECHANICS; PIEZOELECTRIC CERAMICS; PIEZOELECTRIC MATERIALS; PUNCHING;

ELECTRIC DISPLACEMENT; ELECTRICAL BOUNDARY CONDITIONS; ELECTRO-MECHANICAL FIELDS; ELECTROMECHANICAL BEHAVIOUR; FIELD INTENSITY FACTORS; PIEZOELECTRIC CERAMIC LAYERS; PIEZOELECTRIC LAYERS; STRESS AND ELECTRIC DISPLACEMENT INTENSITY FACTORS;

PIEZOELECTRICITY;

EID: 54149086688     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2009.04.020     Document Type: Erratum

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