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Volumn 54, Issue 2, 2008, Pages 755-762

Novel mixed method for the electrochemical deposition of thick layers of Bi2+xTe3-x with controlled stoichiometry

Author keywords

Bismuth telluride; Electrochemical deposition; Microstructure; Thermoelectrics; Thick film

Indexed keywords

BISMUTH TELLURIDE; ELECTROCHEMICAL DEPOSITION; MICROSTRUCTURE; THERMOELECTRICS; THICK FILM;

EID: 53649108651     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2008.06.065     Document Type: Article
Times cited : (55)

References (32)
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    • S. Diliberto, S. Michel, C. Boulanger, J.M. Lecuire, M. Jägle, S. Drost, H. Böttner, Proceedings of the ICT'03, 22nd International Conference on Thermoelectrics (IEEE Cat. No. 03TH8726) (2003) 661.
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    • J.-P. Fleurial, M.A. Ryan, A. Borshchevsky, W. Phillips, E.A. Kolawa, G.J. Snyder, T. Caillat, T. Kascich, P. Mueller, U.S. Patent No. 6,388,185 (2002).
    • J.-P. Fleurial, M.A. Ryan, A. Borshchevsky, W. Phillips, E.A. Kolawa, G.J. Snyder, T. Caillat, T. Kascich, P. Mueller, U.S. Patent No. 6,388,185 (2002).
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    • H.J. Goldsmid, Proceedings of the Physical Society of London 71 (1958) 633.
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  • 32
    • 53649109608 scopus 로고    scopus 로고
    • W. Glatz, E. Schwyter, L. Durrer, C. Hierold, Journal of Microelectromechanical Systems, submitted for publication.
    • W. Glatz, E. Schwyter, L. Durrer, C. Hierold, Journal of Microelectromechanical Systems, submitted for publication.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.