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Volumn 93, Issue 13, 2008, Pages

Toward the existence of ultrafast diffusion paths in Cu with a gradient microstructure: Room temperature diffusion of Ni

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; COPPER; CRYSTAL GROWTH; DIFFUSION; GRADIENT METHODS; GRAIN BOUNDARIES; MICROSTRUCTURE; NICKEL ALLOYS; SEMICONDUCTOR DOPING; SURFACE TREATMENT;

EID: 53349095318     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2992628     Document Type: Article
Times cited : (24)

References (17)
  • 4
    • 85044368241 scopus 로고    scopus 로고
    • Interface diffusion in Cu processed by means of surface mechanical attrition treatment
    • (to be published).
    • Z. B. Wang, K. Wang, K. Lu, G. Wilde, and S. Divinski, " Interface diffusion in Cu processed by means of surface mechanical attrition treatment.," Defect Diffus. Forum (to be published).
    • Defect Diffus. Forum
    • Wang, Z.B.1    Wang, K.2    Lu, K.3    Wilde, G.4    Divinski, S.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.