Cu diffusion along Al grain boundaries

Materials Letters

Volumn 62, Issue 30, 2008, Pages 4477-4479

  Dolgopolov, N ^a   Rodin, A ^a   Simanov, A ^a   Gontar, I ^a  

^a NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY MISIS   (Russian Federation)

Author keywords

Aluminum; Copper; Diffusion; Grain boundaries

Indexed keywords

COPPER; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; SEMICONDUCTOR DOPING;

ALUMINUM; CU DIFFUSION; DIFFUSION; GRAIN-BOUNDARY DIFFUSION; TEMPERATURE RANGES;

CRYSTAL GROWTH;

EID: 53249083935     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2008.07.059     Document Type: Article

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