Micron-level actuators for thermal management of microelectronic devices

Heat Transfer Engineering

Volumn 30, Issue 1-2, 2009, Pages 138-147

  Erbas, N ^a   Baysal, O ^b  

^a GE ENERGY   (United States)

^b Old Dominion University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); CHANNEL FLOW; COOLING; COOLING SYSTEMS; ELECTRONIC EQUIPMENT; INTEGRATED CIRCUITS; MIXING; OSCILLATORS (ELECTRONIC); TEMPERATURE CONTROL; THERMAL VARIABLES CONTROL; TWO DIMENSIONAL;

DEVICE SIZES; ELECTRONIC DEVICES; FAILURE RATES; FLUX SYSTEMS; HEAT TRANSFER RATES; MICRO-ELECTRONIC DEVICES; OPERATING TEMPERATURES; PARAMETRIC STUDIES; POWER DISSIPATIONS; SYNTHETIC JETS; TEMPERATURE FIELDS; THERMAL MANAGEMENT;

ACTUATORS;

EID: 52949112203     PISSN: 01457632     EISSN: 15210537     Source Type: Journal    
DOI: 10.1080/01457630802293662     Document Type: Conference Paper

References (22)

1. Yeh, L. T., and Chu, R. C., Thermal Management of Microelectronic Equipment, ASME Press, New York, 2002.
2. Prasher, R. S., Chang, J. Y., Sauciuc, I., Narasimhan, S., Chau, D., Chrysler, G., Myers, A., Prstic, S., and Hu, C., Nano and Micro Technology-Based Next-Generation Package-Level Cooling Solutions, Intel Tech. Journal, vol. 9, no. 4, pp. 285-296, 2005.
3. ASM International Handbook Committee, Electronic Materials Handbook, Vol. 1: Packaging, Materials Park, Ohio, 1989.
4. Bar-Cohen, A., Kraus, A. D., and Davidson, S. F., Thermal Frontiers in the Design and Packaging of Microelectronic Equipment, Mechanical Engineering, vol. 105, pp. 53-59, June 1983.
5. Baysal, O., Erbas, N., and Koklu, M., Control of Separated Flow Past a Backward Facing Step in Microchannel, Microfluidics and Nanofluidics, vol. 1, no. 1, pp. 86-92, 2004.
6. Erbas, N., Baysal, O., and Koklu, M., Synthetic Jets for Thermal Management of Microelectronic Chips, Proc. 2005 ASME International Mechanical Engineering Congress and Exposition, Orlando, Fla., Paper IMECE2005-81419, 2005.
7. Kercher, D. S., Lee, J. B., Brand, O., Allen, M. G., and Glezer, A., Microjet Cooling Devices for Thermal Management of Electronics, IEEE Transactions on Components and Packaging Technologies, vol. 26, pp. 359-366, 2004.
8. Mahalingam, R., Rumingy, N., and Glezer, A., Thermal Management Using Synthetic Jet Ejectors, IEEE Transactions on Components and Packaging Technologies, vol. 27, pp. 439-444, 2004.
9. Asian, R. A., Baysal, O., and Firat, O. E., Computing Micro Synthetic Jet in Slip Regime with Moving Membrane, Proc. 2002 ASME International Mechanical Engineering Congress and Exposition, New Orleans, La., Paper IMECE2002-33770, 2002.
10. st International Conference on Recent Advances in Space Technologies, Istanbul, Turkey, 2003.
11. st AIAA/ASME/ASCE/ AHS/ASC Structures, Structural Dynamics, and Materials Conference and Exhibit, Atlanta, Georgia, April 2000, AIAA paper 2000-1561, 2000.
12. Baysal, O., Koklu, M., and Erbas, N., Design Optimization of Micro Synthetic Jet Actuator for Flow Separation Control, Journal of Fluids Engineering, vol. 128, no. 5, pp. 1-10, 2006.
13. th AIAA Fluid Dynamics Conference, Reno, Nev., AIAA paper 97-1824, 1997.
14. th AIAA Fluid Dynamics Conference, Reno, Nev., AIAA paper 99-3651, 1999.
15. Rizzetta, D. P., Visbal, M. R., and Stanek, M. J., Numerical Investigation of Synthetic Jet Flow Fields, AIAA Journal, vol. 57, no. 8, pp. 919-927, 1999.
16. Lee, C. Y., and Goldstein, D. B., Two-Dimensional Synthetic Jet Simulation, AIAA Journal, vol. 40, no. 3, pp. 510-516, 2002.
17. Baysal, O., Fouladi, K., and Lessard, V. R., A Multigrid and Upwind Viscous Flow Solver on Three-Dimensional Overlapped and Embedded Grids, AIAA Journal, vol. 29, pp. 903-910, 1990.
18. Baysal, O., and Aslan, R. A., Computing Effect of Flow Separation in MEMS Applications, Proc. 2002 ASME Fluids Engineering Division Summer Meeting, Montreal, Quebec, Canada, Paper FEDSM2002-31157, 2002.
19. st ed., ed. M. Gad-el-Hak, CRC Press, New York, Ch. 4, pp. 4-37, 2002.
20. Beskok, A., Validation of a New Slip Model for Separated Gas Micro-Flows, Numerical Heat Transfer: Fundamentals, vol. 40, no. 6, pp. 451-471, 2001.
21. st ed., ed. M. Gad-el-Hak, CRC Press, New York, Ch. 7, PR 7.1-7.36 2002.
22. Beskok, A., Karniadakis, G. E., and Trimmer, W., Rarefaction and Compressibility Effects in Gas Microflows, Journal of Fluids Engineering, vol. 118, pp. 448-456, 1996.