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Volumn 155, Issue 11, 2008, Pages

Evolution of structure with spacer layer thickness in electrodeposited CoCu multilayers

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER ALLOYS; COPPER PLATING; CORROSION;

EID: 52649131304     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2969770     Document Type: Article
Times cited : (24)

References (22)
  • 2
    • 33750172549 scopus 로고    scopus 로고
    • in, S. Krongelb, Editors, PV 2004-23, The Electrochemical Society Proceedings Series, Pennington, NJ.
    • I. Bakonyi and L. Ṕter, in Magnetic Materials, Processes and Devices VIII, S. Krongelb, Editors, PV 2004-23, p. 227, The Electrochemical Society Proceedings Series, Pennington, NJ, (2006).
    • (2006) Magnetic Materials, Processes and Devices VIII , pp. 227
    • Bakonyi, I.1    Ṕter, L.2
  • 22
    • 52649147610 scopus 로고    scopus 로고
    • Personal communication;, Diploma Thesis, Technical University Bergakademie Freiberg, Germany.
    • C. Schimpf and D. Rafaja, Personal communication; C. Schimpf, Diploma Thesis, Technical University Bergakademie Freiberg, Germany (2007).
    • (2007)
    • Schimpf, C.1    Rafaja, D.2    Schimpf, C.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.