Enrichment and removal of heavy metals contained in PCB boards by multiwalled carbon nanotubes for WEEE directive

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Hua, L ^a   Hou, H N ^a  

^a HUBEI UNIVERSITY OF EDUCATION   (China)

Author keywords

Enrichment and removal; Heavy metals; Multiwalled carbon nanotubes; PCB boards; WEEE directive

Indexed keywords

ADSORPTION; BLAST ENRICHMENT; CADMIUM; CADMIUM COMPOUNDS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; EXTRACTION; HEAVY METALS; INDUCTIVELY COUPLED PLASMA; METAL RECOVERY; METALS; MULTIWALLED CARBON NANOTUBES (MWCN); NANOCOMPOSITES; NANOPORES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; NANOTECHNOLOGY; NANOTUBES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; RIVER POLLUTION; TECHNOLOGY;

CADMIUM IONS; E-WASTES; ELECTRICAL EQUIPMENTS; ELECTRONIC PACKAGING; ENRICHMENT AND REMOVAL; HAZARDOUS MATERIALS; HIGH-DENSITY PACKAGING; ICP-OES; INTERNATIONAL CONFERENCES; LIMIT-OF-DETECTION; MULTIWALLED CARBON NANOTUBES; PCB BOARDS; PROMISING MATERIALS; REMOVAL OF HEAVY METALS; SOLID-PHASE EXTRACTION; WEEE DIRECTIVE; WEEE DIRECTIVES;

CARBON NANOTUBES;

EID: 52449129292     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4607151     Document Type: Conference Paper

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