Simulation on thermal characteristics of LED chips for design optimization

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Cheng, Ting ^a   Luo, Xiaobing ^a,b   Huang, Suyi ^a   Gan, Zhiyin ^a,b   Liu, Sheng ^a,b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MODEL STRUCTURES; OPTIMIZATION; TECHNOLOGY; THERMOELECTRICITY;

DESIGN OPTIMIZATION; ELECTRONIC PACKAGING; FINITE-ELEMENT METHODS; HIGH-DENSITY PACKAGING; HIGH-POWER LED; INTERNATIONAL CONFERENCES; JUNCTION TEMPERATURES; LED CHIPS; ON CHIPS; SUBSTRATE MATERIALS; THERMAL PERFORMANCE; TRANSFER MECHANISMS; VALIDATED MODEL;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 52449121241     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4607030     Document Type: Conference Paper

References (7)

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