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Volumn , Issue , 2008, Pages
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Dynamic mechanical properties of the transparent silicone resin for high power LED packaging
c
FineMEMS Inc
(China)
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Author keywords
[No Author keywords available]
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Indexed keywords
DC GENERATORS;
DYNAMIC ANALYSIS;
ELECTRONICS PACKAGING;
MECHANICAL PROPERTIES;
RELIABILITY;
RELIABILITY ANALYSIS;
RESINS;
SILICONES;
TECHNOLOGY;
COMPRESSION MODE;
DYNAMIC MECHANICAL;
DYNAMIC MECHANICAL ANALYSIS (DMA);
DYNAMIC MECHANICAL PROPERTIES;
ELECTRONIC PACKAGING;
HIGH POWERS;
HIGH-DENSITY PACKAGING;
HIGH-POWER LED;
HIGH-POWER LEDS;
INTERNATIONAL CONFERENCES;
SILICONE RESIN;
STORAGE MODULUS;
TEMPERATURE SPECTRUM;
VISCOELASTIC BEHAVIORS;
WHITE-LIGHT LEDS;
DYNAMIC MECHANICAL ANALYSIS;
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EID: 52449110279
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ICEPT.2008.4607073 Document Type: Conference Paper |
Times cited : (18)
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References (8)
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