Dynamic mechanical properties of the transparent silicone resin for high power LED packaging

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Zhang, Qin ^a,b   Mu, Xiu ^c   Wang, Kai ^a,b   Gan, Zhiyin ^a,b   Luo, Xiaobing ^a   Liu, Sheng ^a,b,c  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^c FineMEMS Inc   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DC GENERATORS; DYNAMIC ANALYSIS; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; RELIABILITY; RELIABILITY ANALYSIS; RESINS; SILICONES; TECHNOLOGY;

COMPRESSION MODE; DYNAMIC MECHANICAL; DYNAMIC MECHANICAL ANALYSIS (DMA); DYNAMIC MECHANICAL PROPERTIES; ELECTRONIC PACKAGING; HIGH POWERS; HIGH-DENSITY PACKAGING; HIGH-POWER LED; HIGH-POWER LEDS; INTERNATIONAL CONFERENCES; SILICONE RESIN; STORAGE MODULUS; TEMPERATURE SPECTRUM; VISCOELASTIC BEHAVIORS; WHITE-LIGHT LEDS;

DYNAMIC MECHANICAL ANALYSIS;

EID: 52449110279     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4607073     Document Type: Conference Paper

References (8)

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