The study of thermal resistant enhancement of siloxane-modified LED transparent encapsulants

Materials Research Society Symposium Proceedings

Volumn 1007, Issue , 2008, Pages 23-27

  Chen, Kai Chi ^a   Hsu, Chia Wen ^a   Li, Hsun Tien ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHEMICAL ANALYSIS; CURING; DRYING; ELECTRIC BATTERIES; EPOXY RESINS; ETHERS; HEAT RESISTANCE; ORGANIC COMPOUNDS; PAINTING; PHENOLS; RECONNAISSANCE AIRCRAFT; RESINS; SILICONES; THERMAL AGING; THERMAL SPRAYING; THERMODYNAMIC STABILITY;

CO-CURING; CURING AGENTS; DIGLYCIDYL ETHER OF BISPHENOL-A; DISILOXANE; ENCAPSULANTS; EPOXY ENCAPSULANTS; HIGH TEMPERATURE STORAGE; MATERIALS RESEARCH SOCIETY; MODIFIED EPOXY; NORBORANE; ORGANIC/INORGANIC HYBRID MATERIALS; TETRA METHYL; THERMAL RESISTANCE; THERMAL STABILITY;

HYBRID MATERIALS;

EID: 52349108055     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Ann W. Norris, Maneesh Bahadur, and Maloto Yoshitake, "Novel Silicone Materials for LED Packaging" Proc. of SPIE Vol. 5941 594115-1- 594115-7.
2. US patent: US2005/0282976A1
3. US Patent: US6632592B2
4. Hsun-Tien Li, Hsun-Ren Chuang, Ming-Wei Wang and Mu-Shih Lin, "Synthesis, Properties and pyrolysis of siloxane- and imide-modified epoxy resin cured with siloxane-containg dianhydride" Polym. Int. 54, 1416-1421 (2005).
5. US Patent: US6507049B1
6. US Patent: US2005/0282975A1