A study of deformation and stress-strain distribution of nano-scale rod under bending load by molecular dynamics and FEM

Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao

Volumn 29, Issue 1, 2008, Pages 1-11

  Lin, Zone Ching ^a   Huang, Jen Ching ^b   Chao, Yen Chieh ^b  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b TUNGNAN UNIVERSITY   (Taiwan)

Author keywords

Bending; Finite element method; Molecular dynamics; Nano scale thin film; Stress strain behavior

Indexed keywords

ATOMIC PHYSICS; ATOMS; BENDING (DEFORMATION); COPPER; DYNAMICS; ELASTICITY; ERROR CORRECTION; IMAGE SEGMENTATION; MOLECULAR DYNAMICS; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; QUANTUM CHEMISTRY; SOLDERED JOINTS; STRAIN; TURPENTINE;

BENDING; BENDING LOADS; ELASTIC FIELDS; ELASTIC STRESSES; FINITE ELEMENT ANALYSIS; FORCE ERROR; NANO SCALING; NANO-SCALE THIN FILM; RIGID BODIES; RIGID-BODY DISPLACEMENTS; STRESS-STRAIN BEHAVIOR; STRESS-STRAIN DISTRIBUTIONS;

FINITE ELEMENT METHOD;

EID: 52349089804     PISSN: 02579731     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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