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Volumn , Issue , 2008, Pages 49-50

Soft error rates of radhard sequentials utilizing local redundancy

Author keywords

[No Author keywords available]

Indexed keywords

ACTINIDES; CLOCKS; ELECTRIC NETWORK ANALYSIS; HARDENING; LEARNING SYSTEMS; MACHINE DESIGN; MECHANISMS; METALS; NANOTECHNOLOGY; NEUTRON IRRADIATION; NEUTRONS; QUALITY ASSURANCE; RADIATION HARDENING; RADIATION PROTECTION; REDUNDANCY; RELIABILITY; SEPARATION; TECHNOLOGY; WIRELESS TELECOMMUNICATION SYSTEMS;

EID: 52049108013     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IOLTS.2008.61     Document Type: Conference Paper
Times cited : (13)

References (7)
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    • Sept, Pages
    • P. Hazucha,. Et al., "Measurements and analysis of SER-tolerant latch in a 90-nm dual-Vt CMOS process", IEEE Journal of Solid-State Circuits, Volume 39, Issue 9, Sept. 2004 Page(s):1536 - 1543
    • (2004) IEEE Journal of Solid-State Circuits , vol.39 , Issue.9 , pp. 1536-1543
    • Hazucha, P.1    Et al.2
  • 3
    • 0030375853 scopus 로고    scopus 로고
    • Upset hardened memory design for submicron CMOS technology
    • Dec
    • T. Calin, et al., "Upset hardened memory design for submicron CMOS technology", IEEE Trans. Nucl. Sci., vol. 43, no. 6, pp. 2874-2878, Dec. 1996
    • (1996) IEEE Trans. Nucl. Sci , vol.43 , Issue.6 , pp. 2874-2878
    • Calin, T.1
  • 4
    • 15044363155 scopus 로고    scopus 로고
    • Robust System Design with built-in soft error resilience
    • S. Mitra et al., "Robust System Design with built-in soft error resilience", Computer, vol. 38, no. 2, pp. 43-52, 2005.
    • (2005) Computer , vol.38 , Issue.2 , pp. 43-52
    • Mitra, S.1
  • 5
    • 33846595665 scopus 로고    scopus 로고
    • Sequential Element Design With Built-In Soft Error Resilience
    • Dec, Pages
    • M. Zhang, et al., "Sequential Element Design With Built-In Soft Error Resilience," IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Volume 14, Issue 12, Dec. 2006 Page(s):1368 - 1378.
    • (2006) IEEE Transactions on Very Large Scale Integration (VLSI) Systems , vol.14 , Issue.12 , pp. 1368-1378
    • Zhang, M.1
  • 6
    • 50249185641 scopus 로고    scopus 로고
    • A 45nm Logic Technology with High-k+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging
    • K. Mistry, et al., "A 45nm Logic Technology with High-k+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging", Technical Digest of the IEEE International Electron Devices Meeting, pp. 247-250, 2007
    • (2007) Technical Digest of the IEEE International Electron Devices Meeting , pp. 247-250
    • Mistry, K.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.