SCOPUS 정보 검색 플랫폼

Journal of Sol-Gel Science and Technology

Volumn 48, Issue 1-2, 2008, Pages 40-46

Modeling of thermal conduction in granular silica aerogels

(4) Spagnol, S a,b Lartigue, B a Trombe, A a,b Gibiat, V a

a UNIVERSITÉ DE TOULOUSE (France)

b INSA (France)

Author keywords

Grain packings; Heat conduction; Silica aerogels; Superinsulants; Thermal contact resistance

Indexed keywords

AEROGELS; CERAMIC MATERIALS; COMPUTER SIMULATION; GELATION; HEAT CONDUCTION; LINEAR EQUATIONS; SILICA; SILICA GEL; SILICATE MINERALS; SILICON COMPOUNDS; THERMAL CONDUCTIVITY; TWO DIMENSIONAL;

BUILDING SECTORS; EFFECTIVE PROPERTIES; FRACTAL PATTERNS; GRAIN PACKINGS; HEAT DIFFUSION EQUATIONS; LARGE SIZES; MONOLITHIC SILICA AEROGELS; NANO PORES; NANO-POROUS; NUMERICAL SIMULATIONS; SILICA AEROGELS; SOL - GEL; SUPERINSULANTS; SUPERINSULATION; THERMAL CONTACT RESISTANCE; TWO PHASES;

COLLOIDS;

EID: 51949103087 PISSN: 09280707 EISSN: None Source Type: Journal
DOI: 10.1007/s10971-008-1759-3 Document Type: Article

Times cited : (24)

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