SCOPUS 정보 검색 플랫폼

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 2008, Pages

Solderability and reliability of printed electronics

(2) Salam, B a Lok, B K a

a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILE PARTS AND EQUIPMENT; BONDING; BRAZING; COPPER; ELECTRIC NETWORK ANALYSIS; ELECTRONICS INDUSTRY; FAILURE ANALYSIS; FRICTION; IDENTIFICATION (CONTROL SYSTEMS); INTEGRATED CIRCUITS; LEACHING; MAGNETIC TAPE; METAL ANALYSIS; METALS; MICROSTRUCTURE; PHENOLS; RELIABILITY; RESINS; SAFETY FACTOR; SILVER; SOLDERING ALLOYS; SURFACE PROPERTIES; SURFACE ROUGHNESS; TECHNICAL PRESENTATIONS; TESTING;

INTERMETALLIC LAYERS; INTERNATIONAL SYMPOSIUM; METAL PARTICLES; MICROSTRUCTURE OBSERVATION; PHENOL RESINS; PRINTED ELECTRONICS; SOLDERABILITY; SURFACE ROUGHNESS MEASUREMENTS; TEST RESULTS; TEST VEHICLES; TWO TYPES;

QUALITY ASSURANCE;

EID: 51949089310 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/IPFA.2008.4588211 Document Type: Conference Paper

Times cited : (10)

References (7)

1
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- Frost & Sullivan, "Printed Electronics - Technologies and Applications - 2007," www.frost.com, assessed on 31 March 2008.
- (2008) Printed Electronics - Technologies and Applications - 2007

2
- 34548253512
- Review of Non-reactive and Reactive Wetting of Liquids on Surfaces
- G. Kumar and K.N. Prabhu, "Review of Non-reactive and Reactive Wetting of Liquids on Surfaces", Advances in Colloid and Interface Science, 133, 2007, pp.61-89.
- (2007) Advances in Colloid and Interface Science , vol.133 , pp. 61-89
- Kumar, G.¹ Prabhu, K.N.²

3
- 0004070892
- McGraw-Hill, 4th Edn
- H.H., Manko, "Solders and Soldering" McGraw-Hill, 4th Edn., 2001.
- (2001) Solders and Soldering
- Manko, H.H.¹

4
- 51949102616
- Polymer Thick Film
- K. Gilleo "Polymer Thick Film" Von Nostrand Reinhold, 1996, pp.202-230.
- (1996) Von Nostrand Reinhold , pp. 202-230
- Gilleo, K.¹

5
- 34250872350
- Studies on design, fabrication and reliability assessment of embedded passives on a high-density interconnect (HDI) organic substrate using a sequential build-up process
- M.G. Varadarajan, K.J. Lee, S.K. Bhattacharya, A. Bhattacharjee, L. Wan, R. Pucha, R.R. Tummala, S. Sitaraman, "Studies on design, fabrication and reliability assessment of embedded passives on a high-density interconnect (HDI) organic substrate using a sequential build-up process" 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006, pp. 188-198.
- (2006) 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis , pp. 188-198
- Varadarajan, M.G.¹ Lee, K.J.² Bhattacharya, S.K.³ Bhattacharjee, A.⁴ Wan, L.⁵ Pucha, R.⁶ Tummala, R.R.⁷ Sitaraman, S.⁸

6
- 0003752969
- D. Frear, H. Morgan, S. Burchett and J. Lau ed, Van Nostrand Reinhold, New York
- D. Frear, H. Morgan, S. Burchett and J. Lau (ed.), The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, New York, 1994, pp. 42-86.
- (1994) The Mechanics of Solder Alloy Interconnects , pp. 42-86

7
- 0004106207
- Pennsylvania, USA
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- (1991) Solder Mechanics: A State of the Art Assessment, TMS, Minerals Metals Materials , pp. 29-104
- Frear, D.R.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.