Design and evaluation of pad grooves for copper CMP

Journal of the Electrochemical Society

Volumn 155, Issue 10, 2008, Pages

  Rosales Yeomans, D ^a   Denardis, D ^b   Borucki, L ^c,d   Philipossian, A ^a,c  

^a University of Arizona   (United States)

^b INTEL CORPORATION   (United States)

^c Araca Inc   (United States)

^d ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ABRASION; CONCENTRATION (PROCESS); COPPER; COPPER OXIDES; DEBRIS; DISSOLUTION; FRICTION; NANOTECHNOLOGY; RATE CONSTANTS; TRIBOLOGY;

CHEMICAL MECHANISMS; CHEMICAL-; CHEMICAL-MECHANICAL-PLANARIZATION; CO-EFFICIENT OF FRICTION; CONTACT AREAS; COPPER CMP; DISSOLUTION RATE; EXPERIMENTAL DATA; FILM REMOVAL; FLASH HEATING; FRICTION FORCES; GROOVED PADS; LEADING EDGES; MECHANICAL ABRASION; NET FLOWS; OXIDE GROWTH; PASSIVE FILMS; POLISHING RATES; REMOVAL RATE; ROOT-MEAN-SQUARE ERRORS; SLURRY FILM; SLURRY TEMPERATURE; SPIRAL GROOVES; TEMPERATURE MODELLING;

SLURRIES;

EID: 51849157373     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2963268     Document Type: Article

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