The synergistic effects of additives on improving the electroplating of zinc under high current densities

Journal of the Electrochemical Society

Volumn 155, Issue 10, 2008, Pages

  Hsieh, Ju Cheng ^a   Hu, Chi Chang ^b,c   Lee, Tai Chou ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^c ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ALDEHYDES; ALUMINUM CORROSION; AMINES; CRYSTAL ORIENTATION; CURRENT DENSITY; DESORPTION; DOPING (ADDITIVES); ELECTROCHEMISTRY; ELECTROPLATING; ETHERS; FLOW INTERACTIONS; HYDROGEN; IMAGING TECHNIQUES; METALLIZING; NONMETALS; ORGANIC COMPOUNDS; PLATING; SURFACE ACTIVE AGENTS; VOLTAMMETRY; ZINC DEPOSITS; ZINC REFINING;

CRYSTALLINE STRUCTURES; CURRENT EFFICIENCIES; ELECTROPLATING BATHS; GRAIN SIZES; HIGH CURRENT DENSITIES; HIGH-CURRENT-DENSITY; HYDROGEN EVOLUTION; LAURYL AMINE; LINEAR SWEEP VOLTAMMETRY; NONYL PHENYL ETHER; PLATING PROCESSES; POLY OXY ETHYLENE; POTENTIAL REGIONS; SYNERGISTIC EFFECTS; WEAK ACIDS; WETTING AGENTS; X-RAY DIFFRACTION; ZINC DENDRITES; ZINC ELECTROPLATING;

ZINC;

EID: 51849153803     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2967343     Document Type: Article

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