Fast analytical parameters fitting of planar spiral inductors

2008 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2008

Volumn , Issue , 2008, Pages

  Issakov, V ^a   Thiede, A ^a   Wojnowski, M ^b   Buyuktas K ^b   Simburger W ^b  

^a UNIVERSITY OF PADERBORN   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNA ACCESSORIES; ANTENNAS; ELECTRIC INDUCTORS; ELECTRONICS ENGINEERING; FIGHTER AIRCRAFT; FREQUENCY ESTIMATION; LEAST SQUARES APPROXIMATIONS; MICROWAVE ANTENNAS; MICROWAVES; SCATTERING PARAMETERS; STANDARDS; TECHNOLOGY;

ANALYTICAL PARAMETERS; CLOSED-FORM EXPRESSIONS; ELECTRONIC SYSTEMS; EQUIVALENT PARAMETERS; FREQUENCY RANGING; GEOMETRY DESIGN; INTERNATIONAL CONFERENCES; ON-CHIP INDUCTORS; PACKAGE TECHNOLOGIES; PLANAR SPIRAL INDUCTORS; S-PARAMETER DATA; S-PARAMETERS; SPIRAL INDUCTORS; STANDARD CMOS TECHNOLOGY;

PARAMETER ESTIMATION;

EID: 51849105658     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/COMCAS.2008.4562827     Document Type: Conference Paper

References (7)

1. M. Kang et al., "A Simple Parameter Extraction Method of Spiral On-Chip Inductors," in IEEE Tran. on Electron Devices, vol. 52, no. 9, Sep. 2005, pp. 1976-1981.
2. Y. Cao et al., "Frequency-Independent Equivalent-Circuit Model for OnChip Spiral Inductors," in IEEE JSSCC, Mar. 2003, pp. 419-426.
3. C. Yue et al., "Physical modeling of spiral inductors on silicon," in IEEE Tran, on Electron Devices, vol. 47, Mar. 2000, pp. 560-568.
4. D. Pozar, "Microwave Engineering", Wiley&Sons, 2nd ed, p. 212, 1998.
5. T. Schiml et al., "A 0.13 μm CMOS Platform with Cu/low-k Interconnect for System on Chip Application," in Symp. VLSI Technology Dig. Tech. Papers, 2001, pp. 101-102.
6. J. Tao et al., "Novel realistic short structure construction for parasitic resistance de-embedding and on-wafer inductor characterization, " in IEEE Conf. on Microelectronic Test Structures, vol. 18, pp. 187-190.
7. M. Wojnowski et al., "High Frequency Characterization of Thin-Film Redistribution Layers for Embedded Wafer Level BGA," in IEEE Electronics Packaging Technology Conference, 2007, pp. 308-314.