Applications of laser transmission processes for the joining of plastics, silicon and glass micro parts

Microsystem Technologies

Volumn 14, Issue 12, 2008, Pages 1879-1886

  Sari, F ^a   Hoffmann, W M ^b   Haberstroh, E ^b   Poprawe, R ^a  

^a FRAUNHOFER INSTITUTE FOR LASER TECHNOLOGY   (Germany)

^b RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; ELASTOMERS; FIBER LASERS; FIBER OPTICS; GLASS; INDUSTRIAL APPLICATIONS; LASERS; MATERIALS PROPERTIES; NONMETALS; OPTICAL PROPERTIES; PLASTIC PRODUCTS; PLASTICITY; PLASTICS APPLICATIONS; POLYMERS; SEMICONDUCTING CADMIUM TELLURIDE; SILICON; THERMOANALYSIS;

ALIGNMENT ACCURACY; ENERGY SOURCING; GERMANY; HIGH-QUALITY; JOINING PROCESSES; JOINING TECHNOLOGIES; LASER TRANSMISSION; MATERIAL CONDITIONS; MICRO ASSEMBLIES; MICRO PARTS; MICRO TECHNOLOGIES; MICRO WELDING; VERSATILE TOOLS;

JOINING;

EID: 51849084653     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0675-3     Document Type: Article

References (11)

1. Chen J-W, Zybko J (2002) Laser assembly technology for planar microfluidic devices. In: SPE (Society of Plastics Engineers) 60th Annual Technical Conference, San Francisco
2. Haberstroh E, Hoffmann W-M (2006) Laser welding of plastics-a technological overview. Weld Cut 5:349-354
3. Haberstroh E, Hoffmann W-M, Poprawe R, Sari F (2006) Laser transmission joining in micro technology. Microsyst Technol 12:632-639. doi: 10.1007/s00542-006-0096-0
4. Kern W (ed) (1993) Handbook of semiconductor wafer cleaning technology, science, technology and applications, Noyes Publications, New Jersey, pp 19-21
5. Klein H (2001) Laserschweißen von Kunststoffen in der Mikrotechnik. Ph. D. RWTH Aachen
6. Mapleston P (2003) New laser welding systems debut. Modern Plastics
7. Pretel E (2006) Untersuchungen zum Laserdurchstrahlschweißen zweier transparenter Fügepartner aus Polycarbonat in der Mikrotechnik. unpublished diploma thesis. Institute of Plastics Processing (IKV) at RWTH Aachen
8. Tong Q-Y, Gösele U (1996) A model of low-temperature wafer bonding and its applications. Electrochem Soc 143:1773-1779. doi: 10.1149/1.1836715
9. Wild MJ (2002) Lokal selektives Bonden von Silizium und Glas mit Laser. Ph. D. RWTH Aachen
10. Wild MJ, Gillner A, Poprawe R (2001a) Locally selective bonding of silicon and glass with laser. Sens Actuators A 93:63-69. doi: 10.1016/S0924-4247(01)00622-7
11. Wild MJ, Gillner A, Poprawe R (2001b) Advances in silicon to glass bonding with laser. Proc SPIE 4407:135-141. doi: 10.1117/12.425293