|
Volumn 496, Issue 1-2, 2008, Pages 323-328
|
Micromechanism of deformation in EMC laminates
|
Author keywords
Bending; Elastic memory composite; Failure mode; Microbuckle
|
Indexed keywords
CARBON FIBERS;
DEFORMATION;
LAMINATED COMPOSITES;
STRAIN;
BENDING;
COMPOSITE LAMINATE;
DEFORMATION MECHANISM;
ELASTIC MEMORY COMPOSITES;
EXPERIMENTAL RESEARCH;
MICROBUCKLE;
MICROBUCKLING;
MICROMECHANISMS;
SPACECRAFT INDUSTRY;
THERMOMECHANICAL CYCLES;
FAILURE MODES;
BENDING;
BUCKLING;
DAMAGE;
DEFORMATION;
ELASTICITY;
FAILURE;
LAMINATES;
PACKAGING;
PAPER PRODUCTS;
PLASTICS;
SOLUTIONS;
|
EID: 51749089996
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2008.05.029 Document Type: Article |
Times cited : (26)
|
References (14)
|