Electromechanical fracture analysis for corners and cracks in piezoelectric materials

International Journal of Solids and Structures

Volumn 45, Issue 22-23, 2008, Pages 5744-5764

  Hwu, Chyanbin ^a   Ikeda, T ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b KYOTO UNIVERSITY   (Japan)

Author keywords

Corner; Crack; Crack opening displacement; Electromechanical fracture analysis; Energy release rate; Interface corner; Interface crack; Multi bonded wedges; Piezoelectric material; Stress electric intensity factor

Indexed keywords

ANISOTROPY; BUILDING MATERIALS; MATRIX ALGEBRA; MEMS; PIEZOELECTRIC CERAMICS; PIEZOELECTRIC DEVICES; PIEZOELECTRIC MATERIALS; PIEZOELECTRICITY;

CORNER; CRACK; CRACK OPENING DISPLACEMENT; ELECTROMECHANICAL FRACTURE ANALYSIS; ENERGY RELEASE RATE; INTERFACE CORNER; INTERFACE CRACK; MULTI-BONDED WEDGES; PIEZOELECTRIC MATERIAL; STRESS/ELECTRIC INTENSITY FACTOR;

CRACKS;

EID: 51649129955     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2008.06.011     Document Type: Article

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