Reliability assessment of high temperature electronics and packaging technologies for venus mission

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2008, Pages 641-642

  Chen, Yuan ^a   Del Castillo, Linda ^a   Aranki, Nazeeh ^a   Assad, Chris ^a   Mazzola, Mike ^b   Mojarradi, Mohammad ^a   Kolawa, Elizabeth ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^b SemiSouth Laboratories Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 51549116492     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2008.4558966     Document Type: Conference Paper

References (2)

1. P. McCluskey, T. Podlesak, R. Grzybowski, "High Temperature Electronics". CRC-Press, 1997
2. V. Bondarenko, M. Mazzola, R. Kelley. C. Wang Y. Liu, W. Johnson, "SiC devices for converter and motor drive applications at extreme temperatures". IEEE Aerospace Conference. 2006