Effect of particle/matrix interfacial character on the high-temperature deformation and recrystallization behavior of Cu with dispersed Fe particles

Acta Materialia

Volumn 56, Issue 17, 2008, Pages 4944-4952

  Miura, H ^a   Tsukawaki, H ^a   Sakai, T ^a   Jonas, J J ^b  

^a UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

^b MCGILL UNIVERSITY   (Canada)

Author keywords

Copper; Dynamic recrystallization; Interaction; Interfaces; Precipitation

Indexed keywords

COPPER; DEFORMATION;

DYNAMIC RECRYSTALLIZATION; HIGH-TEMPERATURE DEFORMATION; INTERACTION; INTERFACES; PRECIPITATION;

STRAIN RATE;

EID: 51449120747     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2008.06.012     Document Type: Article

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