Mechanical and electrical characterisation of individual ACA conductor particles

2006 International Conference on Electronic Materials and Packaging, EMAP

Volumn , Issue , 2006, Pages

  Dou, Guangbin ^a   Whalley, David ^a   Liu, Changqing ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; CONDUCTING POLYMERS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; MANGANESE COMPOUNDS; PACKAGING MATERIALS;

ELECTRONIC MATERIALS AND PACKAGING; EXPERIMENTAL RESEARCH; INTERNATIONAL CONFERENCES;

ADHESIVE JOINTS;

EID: 51449105425     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2006.4430697     Document Type: Conference Paper

References (11)

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2. Fu, Y., Wang, Y. L., Wang, X. T., Liu, J. H., Lai, Z. H., Chen, G. L. and Willander, M., "Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesive," IEEE Transactions on Advanced Packaging, 2000, 23(1): p. 15-21.
3. Kwon, W.-S. and Paik K.-W., "Experimental Analysis of Mechanical and Electrical Characteristics of Metal-Coated Conductive Spheres for Anisotropic Conductive Adhesives (ACAs) Interconnection," IEEE Transactions on Components and Packaging Technologies, 2006, 29(3): p. 528-534.
4. Dou, G.B., Whalley, D.C. and Liu, C.Q., "Deformation Property Measurement for Single Anisotropic Conductive Adhesive Particles," 1st Electronics Systemintegration Technology Conference (ESTC), 2006, Vol II, Dresden, p. 840-847.
5. Zhang, Z.L., Kristiansen H. and Liu, "A method for determining elastic properties of micron-sized polymer particles by using flat punch test," Computational Materials Science, In Press, Corrected Proof, Available online 8 August 2006.
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8. Shen, Y., "Mechanical Properties of Conductive Particles for Anisotropic Conductive Adhesive (ACA)," A Master Thesis in Material Science and Engineering, Chalmers University of Technology.
9. Ogunjimi A. O., Mannan S.H., Whalley D.C. and Williams D.J., "The Assembly Process for Anisotropic Conductive Joints - Some New Experimental and Theoretical Results," Journal of Electronics Manufacturing, Vol 5, No. 4, Dec,1995, p. 263-271.
10. http://www.micromaterials.co.uk
11. Dou, G.B., Whalley D.C. and Liu C.Q., "The effect of coplanarity variation on Anisotropic Conductive Adhesive assemblies," Proceedings of 56th Electronic Components & Technology Conference 2006, Vol 1, 2006, p. 932-938.