Analysis of thermal stress in InP/GaAs bonding by finite element method

Bandaoti Guangdian/Semiconductor Optoelectronics

Volumn 25, Issue 4, 2004, Pages 277-

  Chen, Bin ^a   Zhou, Zhen ^a   Huang, Yong Qing ^a   Ren, Xiao Min ^a  

^a NONE

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EID: 5144225431     PISSN: 10015868     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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